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Application

Medical supplies and devices

Pipette tips, blood collection tubes, test card housings, and device shells: prioritize batch consistency and cleanliness over molding speed.

Common components

Pipette tips, blood collection tubes, culture dishes and test card housings, fluid connectors, device enclosures

Common resins

PP, PS, COC/COP, PC, PEEK, PSU

Shot Weight and Wall Thickness

0.1–10 g per part

walls 0.2–0.8 mm

Long cores in blood collection tubes increase the flow rate.

HomeApplicationsMedical supplies and devices

Three constraints that determine the gate

Shot weight, wall thickness, and flow ratio determine the gate; appearance and cleanliness requirements determine the nozzle type.

Prioritize batch consistency

Dimensions and appearance must match the previous batch. Narrower process windows make it harder to control batch-to-batch drift.

Black specks result from stagnant material, not inspection.

Material accumulates at runner corners, threaded joints, and the tip/manifold interface. Screening at the end of the line only adds cost.

Concentricity of thin walls on long cores

The core obstructs flow during filling. Shear and temperature changes alter viscosity, shifting the core off-center and resulting in uneven walls and a bent tube.

Common parts and matching exercises

Different gate practices are required for different components and requirements within the same industry. This table is organized by component, not by model.

Part

Pipette tips

Common resins

PP

Size and cavitation

0.2–0.8 mm, multi-cavity

Practice

Multi-cavity SD or TP with independent temperature control per cavity

Part

Blood collection tubes

Common resins

PP, PS

Size and cavitation

long core, high flow ratio

Practice

Multi-cavity SD: Align core and gate; record gate freeze time per cavity.

Part

Culture dishes and test card enclosures

Common resins

PS, COC/COP, PC

Size and cavitation

0.3–0.8 mm

Practice

SD; monitor ejection and gate residue

Part

Fluid connectors and device enclosures

Common resins

PEEK, PSU, PC

Size and cavitation

0.5–2.0 mm

Practice

High-temperature SD with dynamic control for PEEK and PSU; VG for aesthetic components

Molding Challenges and Our Solutions

Each item first explains the mechanism, then our scope of work. Mold temperature, clamping, and drying are out of scope.

Black specks and discoloration

Material accumulates at runner corners, threaded joints, and the tip interface, then degrades.

PRACTICE

Radius runner corners without steps; allow tip removal for inspection; purge per resin requirements. Eliminate dead zones in the structure instead of relying on end-of-line sorting.

Core eccentricity and bending

Shear and temperature changes affect viscosity during filling, while the core shifts under lateral force.

PRACTICE

Control each cavity independently to minimize variation between cavities; align the core and gate; perform flow analysis on thin-wall, long-core parts to verify the flow front.

High-temperature degradation of PEEK and PSU

High processing temperatures and long residence times degrade the melt and release gas.

PRACTICE

Place the sensor close to the melt to reduce control lag; configure a stop/purge procedure for the resin; and avoid prolonged hot standby.

Selection and responsibility boundaries

Scope of services and exclusions are outlined before the proposal and quotation.

SERIES

Open SD and TP, along with valve-gate VG and PVG, are suitable for medical consumables and devices. The specific model is determined by gate position, appearance requirements, and cavity count.

What We Don't Promise

Mold temperature, melt temperature, clamping force, and drying are part of the mold and molding process. A hot runner cannot replace them.

The no-clogging guarantee applies only to straight-through nozzles. Pin-point and valve-gate types have small sections and mating surfaces, so we cannot guarantee they will be clog-free.

We explain any out-of-range calculations at the proposal stage.

Related technical articles

Articles on materials and applications in this industry, sorted by newest first.

Customer case studies

Practice and results only; customer names are not disclosed.

Customer case studies for this industry are being prepared.

Return to applications

Drawings first, then the proposal

Send the mold 2D layout, part 3D data, resin grade, wall thickness (including the thinnest section), number of cavities, shot weight, current process parameters, and defect photos.