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Application

Telecom and Data Center

Wall thickness of 0.15–0.30 mm and pin pitch of 0.4–1.0 mm: end-of-fill and board-level coplanarity are the two critical limits for this component type.

Common Parts

High-speed backplane and board-to-board connectors, optical module housings, CPU and memory sockets

Common resins

LCP, PPS+GF, PA9T

Shot Weight and Wall Thickness

0.2–5 g per part

walls 0.15–0.30 mm

pin pitch 0.4–1.0 mm

HomeApplicationsTelecom and Data Center

Three constraints that determine the gate

Shot weight, wall thickness, and flow ratio determine the gate; appearance and cleanliness requirements determine the nozzle type.

Thin walls increase pressure loss.

Below 0.2 mm, the same flow length requires higher injection speed and pressure. For end-of-flow short shots, check runner resistance first, not clamping force.

LCP freezes quickly; cold slugs clog the gate first.

LCP flow depends on shear and temperature. A cold gate freezes at the tip; a cold slug entering the cavity causes short shots and black specks.

Coplanarity out of tolerance: Reject

Board-level coplanarity is determined by orientation and cooling; it cannot be corrected after ejection. Gate and runner balance must be resolved before steel cutting.

Common parts and matching exercises

Different gate practices are required for different components and requirements within the same industry. This table is organized by component, not by model.

Part

High-speed backplane connectors

Common resins

LCP

Size and cavitation

0.15–0.25 mm, multi-cavity, fine pitch

Practice

SD with dynamic gate control; cavity-by-cavity zoning to prevent early-filling cavities from overheating

Part

Board-to-board connectors

Common resins

LCP, PPS+GF

Size and cavitation

0.20–0.30 mm

Practice

SD as the base; TP where appearance is critical

Part

Optical module enclosures

Common resins

PPS+GF, PA9T

Size and cavitation

0.3–0.6 mm

Practice

SD; Monitor weld-line position opposite the gate

Part

CPU and memory slots

Common resins

LCP, PA9T

Size and cavitation

0.2–0.4 mm

Practice

Multi-cavity SD with zone sequencing; control weld lines in dense pin arrays

Molding Challenges and Our Solutions

Each item first explains the mechanism, then our scope of work. Mold temperature, clamping, and drying are out of scope.

End-of-flow short shots

Thin walls with long flow paths cause excessive pressure loss, preventing the melt from reaching the end within a fillable viscosity range.

PRACTICE

Calculate pressure loss and required injection speed based on the flow ratio; set gate position using flow analysis; add cavity zoning if needed. Do not rely solely on increasing melt temperature.

Cold slug clogging

LCP freezes quickly; the tip freezes first at stop or low temperatures.

PRACTICE

The straight-through passage has no reduced section. Synchronize switch gate heating with the molding cycle, purge as resin requires, and ensure no residue remains at the tip.

Warpage and coplanarity

Fibre orientation and uneven cooling combine, especially in thin walls.

PRACTICE

Set gate and runner balance using flow analysis; verify mold-temperature zoning and packing profile separately. Hot runner controls gate temperature only, not mold temperature.

Selection and responsibility boundaries

Scope of services and exclusions are outlined before the proposal and quotation.

SERIES

Open SD and TP, and valve-gate VG and PVG; all are suitable for telecom and data center applications. The specific model is determined by gate position, appearance requirements, and cavitation conditions.

What We Don't Promise

Mold temperature, melt temperature, clamping force, and drying are part of the mold and molding process. A hot runner cannot replace them.

The no-clogging guarantee applies only to straight-through nozzles. Pin-point and valve-gate types have small sections and mating surfaces, so we cannot guarantee they will be clog-free.

We explain any out-of-range calculations at the proposal stage.

Related technical articles

Articles on materials and applications in this industry, sorted by newest first.

Customer case studies

Practice and results only; customer names are not disclosed.

Customer case studies for this industry are being prepared.

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Drawings first, then the proposal

Send the mold 2D layout, part 3D data, resin grade, wall thickness (including the thinnest section), number of cavities, shot weight, current process parameters, and defect photos.